Total citations for the following article is (3) : Details of Citation
Electroless Copperdeposition using Saccharose Containing Copper Methane Sulphonate Bath with Thiourea as Stabilizer
P.BALARAMESH, S.REKHA, P.VENKATESH and S.SHANMUGAN
RMK engineering College, RSM Nagar, Kavaraipettai, Chennai, Tamilnadu, India
RMD Engineering College, RSM Nagar, Kavaraipettai, Chennai, Tamilnadu, India
Pachayaippa’s College, Chennai, Tamilnadu, India
Nano Optoelectronics Research Laboratory, School of Physics, Universiti Sains Malaysia (USM),11800, Minden, Pulau Pinang, Malaysia
Chem Sci Trans., 2014 | DOI:10.7598/cst2014.848
|
View Abstract | FullText
|
This article has been cited by :
P. BalaRamesh , P. Venkatesh,; Studies on Diethanolaminedithiocarbamate as Metal Complex, Complexing Agent and Stabilizer in Copper Methanesulphonate Bath
International Journal of Science and Research, Volume 4 Issue 2, February 2015 |
View at Journal site |
-
S. Jayalakshmi et al., RECENT ADVANCES IN ELECTROLESS COPPER DEPOSITION – A REVIEW
International Journal of Advanced Research in Engineering and Applied Sciences, Vol. 5 | No. 8 | August 2016 |
View at Journal site |
-
Yongchan Lim, Changhee Lee, Hayoung Choi, Jinyoung Bae, Fabrication of electrically conductive substrates using copper nanoparticles-deposited carbon black
Journal of Composite Materials, 0(0) 1–9, 2016 |
View at Journal site |
-